Jun-46 |
Tsuneo Komata founded business in Toyonaka City, Osaka. |
Aug-53 |
Daisho Seiki Seisakusyo Ltd. founded with 2 milion yen capitalization. |
Jul-57 |
New factory and headquarters completed in Ikeda City. |
Jul-77 |
Starts delivering peeling machines to Eastern Europe (Romania and Poland). |
Sep-81 |
Establish a representative office in Chicago, USA |
Jul-82 |
Increase of capital to 41,000,000 yen |
Sep-82 |
The peeling plant for Eastern Europe completes 13 lines. |
Apr-83 |
Corporate name changed to DAISHO SEIKI CORPORATION. |
Jul-83 |
Build 800 square meters of office building |
Jun-84 |
Export peeling machines to Max Steel, Inc. for the first time in the U.S. |
Mar-89 |
Install peeling and burnishing machines at Carpenter Technologies in the USA. |
Apr-91 |
Expand the head factory. |
Apr-97 |
Company marks 50th anniversary. Kazuharu Komata appointed as president. |
Jan-00 |
Seoul Office opened in Korea. |
May-00 |
Daisho Seiki American Corporation (Chicago office) established in U.S.A. |
Jun-06 |
Transform the Daisho Seoul office to Daisho Seiki Korea Co., Ltd with manufacturing facility structured as a korean local subsidiary. |
Jan-08 |
Increase of capital to 70,000,000 yen |
Oct-09 |
ISO9001 : 2008 Certified |
Jan-12 |
Business Tie-up withJ.L.Lucas in U.S.A. |
Oct-12 |
Exported the serial number #100 of Double Disk Grinding Machine for Brake Disk Grinding. |
Nov-12 |
Acquired land 17,000 m^2 in NAJIO for DAISHO new plant. |
Dec-14 |
Started new plant construction. |
Mar-16 |
Business Tie-up with Steel Equipment Specialists(SES) in U.S.A. |
Jan-17 |
Participation in the Industrial Engineering Group (FIVES: Head Office, France) |
Nov-17 |
ISO9001: 2015 version acquired |
Apr-20 |
Yasutsugu (George) Muranishi appointed as president. |